Polytechnic Institute of Setúbal

Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our university community has its competitive edges in technology, health and society. We are looking for Postdoctoral Research Fellows in the field of Advanced Microelectronics Packaging. The full-time position will be filled for a fixed-term period of 4 years and is connected to TAU’s PROFI8 profiling actions and focuses on fundamental technology and methods development for next-generation semiconductor packaging and heterogeneous integration. The position is located in the in the Electrical Engineering Unit of the Faculty of Information Technology and Communication Sciences. JOB DESCRIPTION Research scope (fundamental methods development) The postdoctoral research fellow will develop and validate low-TRL integration methods that enable electronics–photonics co-packaging and heterogeneous integration across 2D / 2.5D / 3D schemes, including both chip-to-wafer (C2W) and chip-to-chip (C2C) approaches. Core technical directions Heterogeneous integration of wide-bandgap (WBG) electronic components (e.g., GaN/SiC and related platforms) towards high-speed photonics and power electronics, including interface reliability, electrical/thermal interface quality, and thermal-management concepts enabled by thin devices and advanced substrates. Heterogeneous integration of photonic components towards high-density integrated circuits and high-performance III–V functional blocks (e.g., lasers, photodiodes, and high-speed devices), with focus on precision alignment, interface quality, and scalable assembly concepts. Method development in advanced integration approaches such as micro-transfer printing (µTP), layer transfer concepts, and advanced packaging/interconnect solutions as enablers for next-generation systems. Application relevance (motivating targets) While the work is fundamentally oriented, the methods will be developed with clear long-term relevance to demanding application domains such as: Data interfaces to quantum computers, including cryogenic, ultra-high-bandwidth interconnects and packaging concepts for high-speed operation in extreme environments. High-performance power conversion, including packaging/integration concepts for WBG power devices, thermal pathways, reliability under power cycling, and integration of dissimilar materials and functions into compact subsystems. Research environment and infrastructure TAU offers an excellent environment for semiconductor integration research, including strong capabilities spanning chip-level fabrication, advanced packaging, and system-level demonstrators. The work will leverage SiPFAB as a key infrastructure platform for heterogeneous System-in-Package (SiP)-oriented research and packaging process development, complemented by TAU’s broader semiconductor fabrication and characterization infrastructure. Key responsibilities The successful candidate will: Coordinate and lead a subgroup focusing on heterogeneous integration, including topics such as micro-transfer printing, advanced packaging methods, and semiconductor chip-fabrication-related process modules. Drive fundamental methods development (process design, characterization, reliability approaches, and/or toolchain development) and publish results in high-impact venues. Contribute to research group management, including supervision/mentoring of doctoral and master’s students and day-to-day coordination of experimental activities. Support proposal preparation and funding applications in collaboration with senior staff and partners (academia/industry). Potentially participate in teaching related to advanced packaging, heterogeneous integration, and semiconductor fabrication (scope defined based on candidate profile and interests). REQUIREMENTS Applicants are expected to have: A PhD degree (completed by 31st of August, 2026 at the latest) in a relevant field, e.g., electrical engineering, photonics, micro/nanotechnology, semiconductor physics, or materials science. Ability to conduct independent research. Desirable expertise (good to have, not all required) No single applicant is expected to cover everything; however, a strong subset of expertise is needed. Especially valued skills include: Demonstrated ability to publish scientific results, and collaborate in multidisciplinary teams. Hands-on experience in at least some of the following: microfabrication, device/wafer processing, thin-film processes, bonding/assembly, advanced packaging, characterization, and/or reliability testing. III–V chip/device design, fabrication and characterization, including high-speed devices and components such as lasers and photodiodes. HEMTs/FETs, III–V semiconductors, and/or wide-bandgap (WBG) semiconductors (e.g., GaN, SiC and related platforms). Micro-transfer printing (µTP) and/or related heterogeneous integration approaches (layer transfer, advanced bonding concepts, precision alignment methods). Advanced packaging/interconnect methods (e.g., fine-pitch assembly, thermal interface development, encapsulation concepts, high-frequency/cryogenic packaging awareness). Tampere University is a unique, multidisciplinary and boldly forward-looking, evolving community. Our values are openness, diversity, responsibility, courage, critical thinking, erudition, and learner-centeredness. We hope that you can embrace these values and promote them in your work. WE OFFER A 4-year funded postdoctoral position in a rapidly growing research area of strategic importance. The starting date will be as it is agreed by both parties (but by September 1st, 2026 at the latest). A trial period of six (6) months applies to all our new employees. Access to SiPFAB and strong supporting infrastructure for semiconductor fabrication, integration, and characterization at TAU. A collaborative environment with opportunities to build international networks and shape a long-term research agenda in electronics–photonics co-packaging and heterogeneous integration. The salary will be based on both the job demand level and the employee's personal performance in accordance with the Finnish University Salary System. According to the criteria applied to teaching and research staff, the position of the Postdoctoral Research Fellow is placed on the job demand level 5-6. In addition, employees will receive performance-based salary. Therefore, typically, Postdoctoral Research Fellow's salary varies between 3800-4200 €. We offer a wide range of staff benefits, such as occupational health care services, flexible working hours, versatile research infrastructure, modern teaching facilities, excellent sports facilities on campus and several restaurants and cafés on campus with staff discounts. HOW TO APPLY Please check for more details and submit your application here: https://tuni.rekrytointi.com/paikat/?o=A_A&jid=3039 The closing date for applications is May 11th, 2026 (23:59, EEST / UTC+3).  Applications and all accompanying documentation should be written in English and in PDF format only. Please note that applicants may be invited to participate to an interview throughout the application period and therefore we encourage you to apply as soon as possible. Tampere University supports equality, diversity and inclusion and encourages applications from individuals of all backgrounds.