Industrial technology trade fair on applications of micro-encapsulation S&T

October 3, 2003

Brussels, 02 Oct 2003

An industrial technology trade fair, dedicated to the applications of micro-encapsulation sciences and technologies (S&T), will take place on 11 and 12 December in Geneva, Switzerland.

The trade fair will present the major trends in microencapsulation technologies and markets, and will seek to create long term partnerships between technology providers and end-users

At an exhibition area, participants will have the opportunity to view concrete examples of microencapsulated products, as well as materials and technologies for microencapsulation.

The trade fair is being organised and supported by VIBST, an EU project funded under the 'competitive and sustainable growth programme' of the Fifth Framework Programme.

For further information, please consult the following web address:
http:/// dex.html

CORDIS RTD-NEWS / © European Communities

Register to continue

Why register?

  • Registration is free and only takes a moment
  • Once registered, you can read 3 articles a month
  • Sign up for our newsletter
Please Login or Register to read this article.