Brussels, 02 Oct 2003
In addition to a lack of standardisation, one of the main obstacles to the integration of miniaturised electronic components in the aeronautics field is the difficulty of managing the high amounts of heat produced. The EU-funded MCUBE project has found an answer in the form of highly heat-dissipative 'three-dimensional' modules, grouping electronic components within a single unit. High heat-dissipative capabilities are endowed through the use of specialised 'integrated micro heat pipes'.
The new modules are 50% smaller than existing components and weigh 30% less, but project partners say that combining different technologies in a single package also offers other advantages: improved systems performance; increased speed; improved power efficiency and reliability.
The MCUBE consortium includes research establishments, international companies and a small to medium-sized enterprise (SME). Partners say the team has worked well together, with each party contributing according to its own expertise and experience. EU coordinators expect to see MCUBE modules in working aircraft in the not-too-distant future.