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Research Fellow (3D Aerosol Jet Printing)

Closing date
29 Dec 2023

Job Description

ECE Department of National University of Singapore is seeking a skilled and motivated 3D Aerosol Jet Printer Research Fellow to join our dynamic team. The successful candidate will play a critical role in our innovative project focused on the integration of rigid electronics components onto flexible substrates. The primary objective is to utilize 3D aerosol jet printing technology to create precise and robust interconnects between these components on flexible substrates.


  • Operate and maintain 3D aerosol jet printing equipment, ensuring optimal performance and quality of printed interconnects.
  • Collaborate with cross-functional teams to integrate rigid electronics components onto flexible substrates using 3D aerosol jet printing.
  • Develop and optimize inks with high electrical conductivity and flexibility, suitable for 3D aerosol jet printing applications.
  • Conduct experiments, analyze data, and refine printing parameters to achieve desired interconnect properties such as electrical conductivity, flexibility, and adhesion.
  • Troubleshoot and resolve technical issues related to the 3D aerosol jet printing process to ensure consistent and reliable interconnect fabrication.

Interested applicants may send their motivation letter and CV via email to 


Candidate should meet at least 4 criteria from the following list:

  • Ph.D. degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
  • Experience in operating and maintaining 3D aerosol jet printers and familiarity with associated software and hardware.
  • Strong understanding of materials properties and ink formulations, particularly in achieving high electrical conductivity and flexibility.
  • Hands-on experience in developing and optimizing inks for additive manufacturing processes, preferably for electronics applications.
  • Ability to work in a collaborative team environment and communicate effectively with cross-functional teams.
  • Experience in integrating rigid electronics components onto flexible substrates is a plus.

More Information

Location: Kent Ridge Campus
Organization: College of Design and Engineering
Department : Electrical and Computer Engineering
Employee Referral Eligible: No
Job requisition ID : 22531

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