Research Fellow (3D-IC Package Fault Localisation and Failure Analysis (FA))

29 Sep 2023
End of advertisement period
29 Oct 2023
Contract Type
Fixed Term
Full Time

Job Description

  1. Contribute to magnetic field imaging (MFI) system and 3D solver solutions optimisation.
  2. Involve in 3D-IC forward predictive modelling (i.e. include chip and circuit blocks) and ML feature set to integrate with MFI tool interfaces.
  3. Support and aid researchers in data generations, acquisitions and analytics required for ML MFI fault isolation.
  4. Contribute to research article publications and invention disclosures.
  5. Assist new equipment purchases and commissioning.
  6. Assume super-user role of single equipment (ownership and maintenance)
  7. Provide trainings and certifications to new users.

(Interested applicants should send their curriculum vitae via email to


  • PhD Degree in Electrical, Electronics, Mechanical, Chemical Engineering, Physics, Material Science or its equivalent from a reputable University/Institute is preferred, or equivalent related experience. 
  • Candidate with experience in microelectronic research, characterisation, metrology, electrical testing, FA and strong in data analysis will have advantage. 
  • Knowledge of AI/ML/DL development and TCAD modelling. 
  • Self-driven and good communication skill including writing and presenting.
  • Open to fixed term contract

More Information

Location: Kent Ridge Campus
Organization: College of Design and Engineering
Department : Electrical and Computer Engineering
Employee Referral Eligible: No
Job requisition ID : 19971

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