​​​​​​​Chair (W3) of Electronics Packaging

Dresden, Sachsen (DE)
30 Aug 2023
End of advertisement period
27 Oct 2023
Contract Type
Full Time

TUD Dresden University of Technology, as a University of Excellence, is one of the leading and most dynamic research institutions in the country. Founded in 1828, today it is a globally oriented, regionally anchored top university as it focuses on the grand challenges of the 21st century. It develops innovative solutions for the world's most pressing issues. In research and academic programs, the university unites the natural and engineering sciences with the humanities, social sciences and medicine. This wide range of disciplines is a special feature, facilitating interdisciplinarity and transfer of science to society. As a modern employer, it offers attractive working conditions to all employees in teaching, research, technology and administration. The goal is to promote and develop their individual abilities while empowering everyone to reach their full potential. TUD embodies a university culture that is characterized by cosmopolitanism, mutual appreciation, thriving innovation and active participation. For TUD diversity is an essential feature and a quality criterion of an excellent university. Accordingly, we welcome all applicants who would like to commit themselves, their achievements and productivity to the success of the whole institution.

The Faculty of Electrical and Computer Engineering, Institute of Electronic Packaging Technology invites applications for the

Chair (W3) of Electronics Packaging

to be filled on October 1, 2025.

You (m/f/x) will represent the subject area in research and teaching within the degree programs at the Faculty of Electrical and Computer Engineering. This includes current modules of the basic and specialized studies in the diploma and master's degree programs with a high proportion of laboratory practical courses as well as future modules with an increased international orientation. We would also like your active participation in the basic education and teaching export of the Faculty of Electrical and Computer Engineering. You will have the opportunity to develop and implement a challenging, future-oriented and application-oriented research program in the field of packaging and interconnection technology in electronics. In particular, the research activities of the Faculty of Electrical Engineering and Information Technology and the local research network in the fields of biomedical engineering, optoelectronics, sustainable electronics and state-of-the-art electronics shall be strengthened, which requires a corresponding interdisciplinary connection. You should also maintain and further expand the extensive existing technological and diagnostic equipment with the aim of establishing an interdisciplinary technology and transfer platform. We expect your participation in academic self-administration.

We are looking for you as an individual who is scientifically proven internationally in at least two of the following fields:

  • micro and nano integration
  • innovative substrate technologies materials for system and 3D integration
  • additive technologies 
  • optical, electrical, inductive and capacitive interconnection and coupling technologies 
  • reliability of electronics 
  • diagnostics and characterization. 

We expect from you a successful scientific activity in a current field of the appointment area, excellent research achievements with high development potential, experience in teaching, outstanding didactic skills, success in the acquisition of third-party funding, experience in the guidance and management of scientific and non-scientific staff and a very good national and international network within the specialist community as well as the willingness to cooperate on an interdisciplinary basis. The ability and willingness to offer courses in English is required. We expect the successful candidate to have sufficient language skills in German (language level CEF B1) to perform teaching and administrative duties. Practical experience in the relevant industry is an advantage. Applicants must fulfil the employment qualification requirements of § 59 of the Institutions of Higher Education Act in the Free State of Saxony (SächsHSG).

For further questions, please contact the Dean of the Faculty of Electrical and Computer Engineering, Prof. Dr.-Ing. Karlheinz Bock, email: or the head of the appointment committee, Prof. Dr.-Ing. Andreas Richter, tel. +49 351 463-36336; email:

TUD strives to employ more women in academia and research. We therefore expressly encourage women to apply. The University is a certified family-friendly university and offers a Dual Career Service. We welcome applications from candidates with disabilities. If multiple candidates prove to be equally qualified, those with disabilities or with equivalent status pursuant to the German Social Code IX (SGB IX) will receive priority for employment. If you have any questions about these topics, please contact the Equal Opportunities Officer of the Faculty of Electrical and Computer Engineering (Ms. Lena Elspaß, Phone +49 351 463-40517) or the Representative of Employees with Disabilities (Mr. Roberto Lemmrich, Phone +49 351 463-33175).

Please submit your application, including a CV in tabular form, a description of your scientific career, a list of your scientific publications, and a list of courses taught, results of evaluations (preferably of the last three years) as well as a copy of the certificate of your highest academic degree in hard copy to TU Dresden, Fakultät Elektrotechnik und Informationstechnik, Dekan, Herrn Prof. Dr. Karlheinz Bock, Helmholtzstr. 10, 01069 Dresden, Germany or in electronic form via the TU Dresden SecureMail Portal by sending it to by October 27, 2023 (stamped arrival date of the university central mail service applies).

Reference to data protection: Your data protection rights, the purpose for which your data will be processed, as well as further information about data protection is available to you on the website:

Please find the German version under: