Photonic and photo-acoustic characterization expert

Optical multiplexing and source characterization for the photo-acoustic spectral imaging application

You will work in a team of photonic engineers developing photonic ICs (PICs) and systems for imaging and sensing applications, mainly based on photoacoustics (PA). This is a novel non-invasive sensing technique that relies on the photoacoustic effect: the formation of sound waves following light absorption in a sample. The combination of sound and light offers several advantages as compared to more conventional technologies such as a high penetration depth and a very low limit of detection. Potential applications are mammography, through-skull brain imaging, continuous glucose monitoring (CGM) and so on. 

Using imec's cutting edge silicon photonics technologies, we want to bring photoacoustics to the next level. Key components (amongst others) are very sensitive opto-mechanical ultrasound sensors. These are integrated on-chip with photonic multiplexers, opening the way to new applications such as miniaturized catheters.

As photonic and photoacoustic characterization expert, you will:

• Plan design-of-experiments (DoE) for characterization campaigns to validate components and (sub-)systems
• Characterize PICs and on-chip building blocks including detectors, light sources, wavelength multiplexers, opto-mechanical components and so on using existing die- and wafer-level testers
• Carry out experiments at device and module level
• Design and build new characterization setups (photonic, electro-optic and opto-mechanic)
• Build imaging and sensing technology demonstrator systems
• Support the developments of the diverse system building blocks and interact with the team of experts
• Coordinate PIC packaging (optical, electrical)
• Participate in regular project meetings and contribute to reports and documentation