Research Fellow, 3D Packaging of Nano-Systems
- Recruiter
- NANYANG TECHNOLOGICAL UNIVERSITY
- Location
- Singapore
- Posted
- 24 Nov 2020
- End of advertisement period
- 24 Dec 2020
- Ref
- R00002897
- Academic Discipline
- Engineering & Technology, Electrical & Electronic Engineering, Mechanical & Aerospace Engineering, Physical Sciences, Chemistry, Physics & Astronomy
- Job Type
- Academic Posts, Research Fellowships
- Contract Type
- Permanent
- Hours
- Full Time
A Research Fellow position is available in the School of Electrical & Electronic Engineering.
Job Description
- Work on a project on 3D packaging for near-zero power nano-systems
- Design, fabrication and characterization of 3D nano-systems with primary focus on stacking/bonding
Job Requirements
- PhD in materials science, electrical engineering or mechanical engineering
- Prior experience with TSV, die stacking/bonding, 3D packaging and silicon interposer is required
- Candidate with past experience with 3D stacking is given special consideration
- Knowledge in extremely low power nano-systems is a plus
- Expected to work independently and keep track of the project deliverables
We regret only shortlisted candidates will be notified.
Hiring Institution: NTU
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