Electronics Packaging and Device Engineer

Recruiter
University of Glasgow
Location
Glasgow, Glasgow City (GB)
Salary
Grade 6, £28,660 - £32,236 per annum.
Posted
30 Apr 2019
End of advertisement period
29 May 2019
Contract Type
Permanent
Hours
Full Time

University of Glasgow
College of Science and Engineering
School of Physics and astronomy
Electronics Packaging and Device Engineer
Ref: 025402
Salary: Grade 6, £28,660 - £32,236 per annum. 


This post is full time (35 hours per week) and has funding available until 31 May 2023.

 ‘Good University Guide’ Scottish University of the Year 2018, the University of Glasgow is consistently ranked in the top 100 Universities in the world. Founded in 1451, it is the fourth oldest University in the English-speaking world and now has a number of campuses in Glasgow.  
 
The School of Physics and Astronomy brings you to the forefront of cutting edge technology and provides the opportunity to work in world-leading  research groups with internationally acclaimed groupings across the full spectrum of the field covering everything from nature's building blocks to the application of the latest scientific advances in areas such as healthcare and environmental monitoring. 

With a long and illustrious reputation for cutting edge research impact over many years in areas, members of the department have worked on some of recent advances in physics including the discovery of the Hiogs Boson and the detection of gravitational waves. The School of Physics and Astronomy is highly rated by the UK government for its research, and our research groups are internationally renowned for their work.  

We are seeking a highly motivated individual with experience of semiconductor device packaging to take the leading role in developing and running the flip-chip process for the experimental particle physics group. 
The successful candidate will be responsible for commissing the flip-chip process on the group’s new SET FC150 flip-chip bonder. Using the commissioned system, they will deliver the flip-chip required to bond silicon pixel sensors to readout ASICs for the ATLAS Tracker Upgrade project and develop new flip-chip processes for hybrid pixel modules based on novel materials and structures.  

The candidate should have worked in semiconductor device manufacturing with experience of packaging of devices, particularly of flip-chip bonding. The candidate should be able demonstrate the ability work both independently and as part of a team. They will report on their work to the Glasgow particle physics group and also to national and international collaborators.  

Additional company benefits include a fantastic work-life balance with generous annual leave, training and development, great discounts from Glasgow businesses and other benefits of your choice. 

Visit our website for further information on the University of Glasgow’s School of Physics & Astronomy at https://www.gla.ac.uk/schools/physics/ 

Apply online at https://www.gla.ac.uk/it/iframe/jobs/ 

Vacancy ref: 025402 

Closing Date: 29 May 2019 


It is the University of Glasgow’s mission to foster an inclusive climate, which ensures equality in our working, learning, research and teaching environment.

We strongly endorse the principles of Athena SWAN, including a supportive and flexible working environment, with commitment from all levels of the organisation in promoting gender equity.  The School of Physics and Astronomy is the proud holder of an Athena SWAN Silver Award. Interviewees will be eligible for carer expenses, which will be covered by the School. 

The University of Glasgow, charity number SC004401.