Work on hands-on experiment for the few of the following tasks:
- Fabrication of MEMS/NEMS resonators, switches and self-powered sensors such as accelerometers, vibration, shocks, acoustic, air flow, temperature, etc
- Fabrication of PZT and/or AlN based piezoelectric MEMS and sensors
- Fabrication of Si MEMS and/or CMOS MEMS
- Fabrication of wafer level packaging technology such as wafer bonding, chip bonding, thin film encapsulation
- Fabrication of TSV
- Design and Simulation of MEMS and NEMS devices and structures using COMSOL, ANSYS and other well-known software
- Integration of the above-mentioned sensors and devices into a self-powered sensor nodes
- Testing of the above sensors for event-based IoT and environment monitoring related applications
- Write 2 or more journal papers based on derived data of the above devices in a year for RF and write one or more journal papers for RA
- Write monthly progress report
- This work is joint-research with Cornell University. Working in an international multi-task team is expected.
- Write new research grant proposals according guidance from Principal Investigator (PI)
- Possess a Bachelor /Masters degree in Electrical Engineering preferably from prestigious university.
- Strong background in hands-on microfabrication techniques and with journal publications (e.g. Nature Comm, JMEMS and Nano Lett, etc) showing such evidences.
- This opening is for research intensive tasks. Applicants with 1 year of relevant research or industry experience in making and testing MEMS/NEMS is preferred.
- Strong knowledge in L-Edit; COMSOL; ANSYS;
- Excellent written and spoken communication.
- At least one 1st-authored international peer-reviewed journal papers.
- Open to fixed-term contract.
Location: Kent Ridge Campus
Department: Electrical And Computer Engineering