Research Fellow, 3D Packaging of Nano-Systems

Location
Singapore
Posted
Wednesday, 21 October 2020
End of advertisement period
Saturday, 21 November 2020
Ref
R00002897
Contract Type
Permanent
Hours
Full Time

A Research Fellow position is available in the School of Electrical & Electronic Engineering.

Job Description

  • Work on a project on 3D packaging for near-zero power nano-systems
  • Design, fabrication and characterization of 3D nano-systems with primary focus on stacking/bonding

Job Requirements

  • PhD in materials science, electrical engineering or mechanical engineering
  • Prior experience with TSV, die stacking/bonding, 3D packaging and silicon interposer is required
  • Candidate with past experience with 3D stacking is given special consideration
  • Knowledge in extremely low power nano-systems is a plus
  • Expected to work independently and keep track of the project deliverables

We regret only shortlisted candidates will be notified.

Hiring Institution: NTU

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